The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2019

Filed:

Jun. 16, 2016
Applicant:

Toppan Printing Co., Ltd., Tokyo, JP;

Inventors:

Jun Araki, Tokyo, JP;

Motoo Yanagiuchi, Tokyo, JP;

Noriyuki Sasaki, Tokyo, JP;

Shunsuke Yajima, Tokyo, JP;

Masashi Goto, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B65D 75/58 (2006.01); B65D 75/30 (2006.01); B65D 65/38 (2006.01); B65D 75/00 (2006.01); B65D 75/52 (2006.01); B65D 33/02 (2006.01); G01N 7/00 (2006.01); B31B 70/60 (2017.01); B31B 70/84 (2017.01); B31B 70/64 (2017.01); B31B 160/20 (2017.01);
U.S. Cl.
CPC ...
B65D 75/5883 (2013.01); B31B 70/60 (2017.08); B31B 70/84 (2017.08); B65D 33/02 (2013.01); B65D 65/38 (2013.01); B65D 75/008 (2013.01); B65D 75/30 (2013.01); B65D 75/52 (2013.01); B65D 75/5827 (2013.01); G01N 7/00 (2013.01); B31B 70/64 (2017.08); B31B 70/844 (2017.08); B31B 2160/20 (2017.08);
Abstract

A flexible package including a package body including a first side-surface film and a second side-surface film sealed in a peripheral portion. The package body has sealed portions formed in side edge portions such that a non-sealed portion is formed in at least one of the sealed portions. The non-sealed portion has a gas injection portion containing a gas which has a specific heat at constant volume of 0.67 kJ/kg·deg or higher at 0° C. and 1 atm. The gas injection portion has a diameter of from 3 to 50 mm and is formed such that a repelling force is from 4 to 30 N at 23° C. and 1 atm when an entire gas injection portion is nipped from both sides of the first and second side-surface films and squeezed until a nipped gas injection portion has a width equal to a half of the diameter of the gas injection portion.


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