The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2019

Filed:

Oct. 11, 2017
Applicants:

Owen Hildreth, Tempe, AZ (US);

April Jeffries, Tempe, AZ (US);

Avinash Mamidanna, Tempe, AZ (US);

Mariana Bertoni, Mesa, AZ (US);

Inventors:

Owen Hildreth, Tempe, AZ (US);

April Jeffries, Tempe, AZ (US);

Avinash Mamidanna, Tempe, AZ (US);

Mariana Bertoni, Mesa, AZ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/02 (2006.01); B41M 7/00 (2006.01); B41J 2/17 (2006.01); B41J 2/045 (2006.01); B41M 5/00 (2006.01);
U.S. Cl.
CPC ...
B41M 7/009 (2013.01); B41J 2/04505 (2013.01); B41J 2/17 (2013.01); B41M 5/0017 (2013.01); B41M 5/0023 (2013.01); B41M 5/0011 (2013.01);
Abstract

Methods and chemistries are described to form electrically conductive adhesion promoters for use with reactive inks. In some implementations, a metal ink is printed on a substrate. An adhesion promoter is deposited on the surface of the substrate. The adhesion promoter reacts to form a covalent bond with the substrate. Subsequently, a reactive metal ink is used to print on a substrate using a drop-on-demand printing process. The reactive metal ink includes metal cations that react with the adhesion promoter-treated substrate surface to form a conductive bond between the adhesion promoter-treated substrate surface and a metal of the reactive metal ink.


Find Patent Forward Citations

Loading…