logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10286702 B1

PDFFull Text
Expired
Date of Patent:
May. 14, 2019

Filed:

Jan. 25, 2016

Electronic circuit board, and production method therefor

Applicant:

Komura-tech Co., Ltd., Higashi-Osaka-shi, Osaka, JP;

Inventors:

Tadashi Kawamoto, Higashi-Osaka, JP;

Shigeru Baba, Higashi-Osaka, JP;

Youichi Sumoto, Higashi-Osaka, JP;

Sakae Murata, Nomi, JP;

Kazuhiko Tanaka, Nomi, JP;

Assignee:

KOMURA-TECH CO., LTD., Higashi-Osaka-shi, JP;

Attorney:

Westerman, Hattori, Daniels & Adrian, LLP

Primary Examiner:

Nathan Milakovich

Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 3/12 (2006.01); B41M 1/30 (2006.01); H05K 3/20 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01); C09D 11/52 (2014.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
B41M 1/30 (2013.01); C09D 11/52 (2013.01); H05K 1/0266 (2013.01); H05K 1/09 (2013.01); H05K 1/097 (2013.01); H05K 3/0052 (2013.01); H05K 3/12 (2013.01); H05K 3/20 (2013.01); H05K 3/386 (2013.01); H05K 3/0008 (2013.01); H05K 3/1275 (2013.01); H05K 2201/0909 (2013.01); H05K 2201/09127 (2013.01);
Abstract

An electronic circuit board includes an ink receiving layer formed from a resin composition containing a polyvinyl acetal resin as a main component, and an electronic circuit formed in a pattern from an electrically conductive ink. An electronic circuit board production method includes the steps of: applying a liquid resin composition containing a polyvinyl acetal resin as a main component to form a layer of the liquid resin composition; heat-drying the liquid resin composition to form an ink receiving layer; and forming an electronic circuit in a predetermined circuit pattern from an electrically conductive ink by a printing method or a transferring method.

Find Patent Forward Citations

Quick Actions:

Kawamoto, Tadashi. (2019). Electronic circuit board, and production method therefor (U.S. Patent No. 10286702). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10286702

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…