The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2019

Filed:

Feb. 11, 2016
Applicant:

Diehl Aircabin Gmbh, Laupheim, DE;

Inventor:

Norbert Staudigel, Neu-Ulm, DE;

Assignee:

Diehl Aircabin GmbH, Laupheim, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/12 (2006.01); B64D 45/00 (2006.01); B32B 3/12 (2006.01); B32B 37/14 (2006.01); B32B 37/12 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
B32B 3/12 (2013.01); B32B 7/12 (2013.01); B32B 37/146 (2013.01); B32B 37/12 (2013.01); B32B 2305/34 (2013.01); B32B 2307/202 (2013.01); B32B 2327/12 (2013.01); B32B 2605/18 (2013.01); B64D 45/00 (2013.01); H01L 23/3107 (2013.01); Y10T 156/103 (2015.01);
Abstract

In a method for manufacturing a sandwich component having a first and a second flat side, in a pre-assembly state all components of the sandwich component in relation to one another are placed in a nominal position: at least one shape-imparting structural layer and a conductor layer having an electrical conductor, and are connected in an assembly step with an adhesive, wherein in the pre-assembly state on both sides of the conductor layer two barrier layers which are vapor-tight are placed as further components and interconnected in such a manner that said two barrier layers enclose the conductor in a vapor-tight manner. A sandwich component having flat sides, manufactured according to the above method, has at least the structural layer and the conductor layer with the conductors, said structural and conductor layers being disposed between the flat sides and connected with the adhesive, and on both sides of the conductor layer the barrier layers as further components are interconnected in such a manner that said two barrier layers enclose the conductor in a vapor-tight manner.


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