The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2019

Filed:

Feb. 23, 2016
Applicant:

Seidensha Electronics Co., Ltd., Arakawa-ku, Tokyo, JP;

Inventors:

Kimihiko Watanabe, Tokyo, JP;

Naokazu Nagasawa, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 41/00 (2006.01); B29C 65/16 (2006.01); B23K 26/57 (2014.01); B23K 26/211 (2014.01); B23K 26/70 (2014.01); B23K 26/06 (2014.01); B29C 65/18 (2006.01); B29C 65/24 (2006.01); B29C 65/78 (2006.01); B29C 65/00 (2006.01); B29K 101/12 (2006.01);
U.S. Cl.
CPC ...
B29C 65/1635 (2013.01); B23K 26/0608 (2013.01); B23K 26/211 (2015.10); B23K 26/57 (2015.10); B23K 26/703 (2015.10); B29C 65/1616 (2013.01); B29C 65/1622 (2013.01); B29C 65/1641 (2013.01); B29C 65/1654 (2013.01); B29C 65/1658 (2013.01); B29C 65/1667 (2013.01); B29C 65/18 (2013.01); B29C 65/245 (2013.01); B29C 65/7882 (2013.01); B29C 66/0342 (2013.01); B29C 66/112 (2013.01); B29C 66/114 (2013.01); B29C 66/1122 (2013.01); B29C 66/1142 (2013.01); B29C 66/1312 (2013.01); B29C 66/21 (2013.01); B29C 66/24221 (2013.01); B29C 66/326 (2013.01); B29C 66/348 (2013.01); B29C 66/3472 (2013.01); B29C 66/3492 (2013.01); B29C 66/41 (2013.01); B29C 66/43 (2013.01); B29C 66/45 (2013.01); B29C 66/522 (2013.01); B29C 66/526 (2013.01); B29C 66/5221 (2013.01); B29C 66/5261 (2013.01); B29C 66/5268 (2013.01); B29C 66/5344 (2013.01); B29C 66/5346 (2013.01); B29C 66/545 (2013.01); B29C 66/63 (2013.01); B29C 66/65 (2013.01); B29C 66/73521 (2013.01); B29C 66/8122 (2013.01); B29C 66/8161 (2013.01); B29C 66/8167 (2013.01); B29C 66/81267 (2013.01); B29C 66/81419 (2013.01); B29C 66/81427 (2013.01); B29C 66/81431 (2013.01); B29C 66/81457 (2013.01); B29C 66/81465 (2013.01); B29C 66/81469 (2013.01); B29C 66/81811 (2013.01); B29C 66/81821 (2013.01); B29C 66/8248 (2013.01); B29C 66/8282 (2013.01); B29C 66/83221 (2013.01); B29C 66/83413 (2013.01); B29C 66/872 (2013.01); B29C 66/8748 (2013.01); B29C 66/919 (2013.01); B29C 66/9161 (2013.01); B29C 66/91212 (2013.01); B29C 66/91216 (2013.01); B29C 66/91221 (2013.01); B29C 66/91231 (2013.01); B29C 66/91421 (2013.01); B29C 66/91431 (2013.01); B29C 66/91641 (2013.01); B29C 66/9241 (2013.01); B29C 66/961 (2013.01); B29C 66/9672 (2013.01); B29C 66/9674 (2013.01); B29C 65/1683 (2013.01); B29C 66/71 (2013.01); B29C 66/73921 (2013.01); B29C 66/81423 (2013.01); B29C 66/8222 (2013.01); B29C 66/8223 (2013.01); B29K 2101/12 (2013.01);
Abstract

A laser welding apparatus is provides that includes: a support member including a heat generation portion which has a size that is limited to correspond to a size of a welding area of a plurality of plastic components and is made from a material that absorbs a laser beam and generates heat, and which generates heat of a temperature that is equal to or greater than a melting temperature of the plastic components; a laser beam irradiation unit for converging a laser beam to be transmitted through the plurality of plastic components, and irradiating the laser beam toward the heat generation portion through the plurality of plastic components; and a welding controller for causing a laser beam to be irradiated at the heat generation portion using the laser beam irradiation unit to thereby cause the heat generation portion to generate heat, and welding abutting faces of a welding area of the plurality of plastic components with heat that is generated.


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