The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2019

Filed:

Aug. 18, 2015
Applicant:

Kyung Dong One Corporation, Seoul, KR;

Inventors:

Ashutosh Sharma, Seoul, KR;

Jae Pil Jung, Seoul, KR;

Jong Hyun Yoon, Cheonan-si, KR;

Bum Gyu Baek, Asan-si, KR;

Heung Rak Sohn, Seoul, KR;

Song Hee Yim, Pyeongtaek-si, KR;

Jong Hyuk Yoon, Pyeongtaek-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 1/02 (2006.01); B23K 35/26 (2006.01); B23K 35/36 (2006.01); C22C 13/00 (2006.01);
U.S. Cl.
CPC ...
B23K 35/262 (2013.01); B23K 35/26 (2013.01); B23K 35/3601 (2013.01); C22C 1/02 (2013.01); C22C 13/00 (2013.01);
Abstract

This invention relates to a lead-free solder alloy composition and a method of preparing a lead-free solder alloy, wherein the lead-free solder alloy composition includes a ceramic powder added to a lead-free solder of Sn-(0.1 to 2) wt % Cu, Sn-(0.5 to 5) wt % Ag, or Sn-(0.1 to 2) wt % Cu-(0.5 to 5) wt % Ag. According to this invention, a novel lead-free solder alloy, which functions as a replacement for a conventional lead-free solder, is provided, thus exhibiting superior spreadability, wettability, and mechanical properties than a conventional lead-free solder.


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