The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2019

Filed:

Jul. 03, 2015
Applicants:

Tomonao Shimizu, Tokyo, JP;

Junichiro Yamagawa, Tokyo, JP;

Inventors:

Tomonao Shimizu, Tokyo, JP;

Junichiro Yamagawa, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61K 6/087 (2006.01); A61K 6/00 (2006.01); A61K 6/08 (2006.01); A61C 19/02 (2006.01); A61K 6/02 (2006.01);
U.S. Cl.
CPC ...
A61K 6/087 (2013.01); A61C 19/02 (2013.01); A61K 6/00 (2013.01); A61K 6/0023 (2013.01); A61K 6/023 (2013.01); A61K 6/08 (2013.01);
Abstract

To enable firm bonding to a member including a polyaryl ether ketone resin. A bonding method including: a bonding material applying step for applying, to the surface of a member including a polyaryl ether ketone resin, a bonding material including (A) a polymerizable monomer and (B) at least a portion of components for configuring a polymerization initiator, the content ratio of polymerizable monomers at least having two or more polymerizable functional groups in a (p2) molecule among all polymerizable monomers being 50% by mass or greater, and the content ratio of polymerizable monomers at least having one or more polymerizable functional groups and one or more functional groups capable of hydrogen bonding in a (p1h1) molecule being 5% by mass or greater; and a curing step for curing the bonding material. A bonding material and bonding kit using the bonding method.


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