The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2019
Filed:
Dec. 09, 2016
The Procter & Gamble Company, Cincinnati, OH (US);
Eric Shawn Goudy, Liberty Township, OH (US);
Jason Lee DeBruler, West Chester, OH (US);
Michael Devin Long, Springfield Township, OH (US);
The Procter & Gamble Company, Cincinnati, OH (US);
Abstract
A method and apparatus for mechanically deforming a substrate assembly. The substrate assembly may advance toward a bonder apparatus. The bonder apparatus may rotate about an axis of rotation. The bonder apparatus may include a plurality of manifolds positioned about the axis of rotation. The substrate assembly may be advanced onto the bonder apparatus such that the substrate assembly is disposed on the plurality of manifolds. Fluid may be passed to the manifolds onto which the leading edge portion and the trailing edge portion of the substrate assembly are disposed. The manifolds may heat the fluid and the heated fluid may be released onto the trailing edge portion and the leading edge portion of the substrate assembly. The heated portion of the substrate assembly may then be bonded forming a seam.