The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2019
Filed:
May. 25, 2016
Applicant:
Yazaki Corporation, Tokyo, JP;
Inventor:
Ken Ito, Shizuoka, JP;
Assignee:
YAZAKI CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/14 (2006.01); H05K 5/00 (2006.01); B29C 45/00 (2006.01); H05K 5/02 (2006.01); H05K 5/03 (2006.01); B29K 67/00 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
H05K 5/0034 (2013.01); B29C 45/0081 (2013.01); B29C 45/14 (2013.01); B29C 45/14336 (2013.01); H05K 5/0226 (2013.01); H05K 5/0247 (2013.01); H05K 5/03 (2013.01); B29K 2067/006 (2013.01); B29L 2031/3481 (2013.01);
Abstract
An outer case in an electronic circuit unit is injection molded by setting the circuit board in a die and injection molding of the outer case by filling molten resin into a cavity in the die, in pressing at least a part of a front surface side of the mold exclusion part facing a non-cavity space by press member toward a rear surface side.
Ito, Ken. (2019). Method for molding outer case of electronic-circuit unit (U.S. Patent No. 10285284). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10285284
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile