The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2019

Filed:

Feb. 08, 2018
Applicant:

Renesas Electronics Corporation, Tokyo, JP;

Inventors:

Koji Bando, Tokyo, JP;

Kuniharu Muto, Tokyo, JP;

Hideaki Sato, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2006.01); H02M 7/48 (2007.01); H02M 7/00 (2006.01); H03K 17/64 (2006.01); H01L 25/18 (2006.01); H01L 23/12 (2006.01);
U.S. Cl.
CPC ...
H02M 7/48 (2013.01); H01L 23/12 (2013.01); H01L 25/16 (2013.01); H01L 25/18 (2013.01); H02M 7/003 (2013.01); H03K 17/64 (2013.01);
Abstract

An electronic device includes a first substrate, a wiring substrate (second substrate) disposed over the first substrate, and an enclosure (case) in which the first substrate and the wiring substrate are accommodated and that has a first side and a second side. A driver component (semiconductor component) is mounted on the wiring substrate. A gate electrode of a first semiconductor component is electrically connected to the driver component via a lead disposed on a side of the first side and a wiring disposed between the driver component and the first side. A gate electrode of a second semiconductor component is electrically connected to the driver component via a lead disposed on a side of the second side and a wiring disposed between the driver component and the second side.


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