The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2019

Filed:

Jan. 27, 2017
Applicant:

Microsoft Technology Licensing, Llc, Redmond, WA (US);

Inventors:

David Lukofsky, San Francisco, CA (US);

Hanfeng Wang, San Jose, CA (US);

Joseph Christopher Bolling, San Francisco, CA (US);

Patrick Timothy Codd, Belmont, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 12/59 (2011.01); H01R 12/52 (2011.01); H01R 13/02 (2006.01); H01B 11/18 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H01R 24/50 (2011.01); H01R 103/00 (2006.01); H01R 12/79 (2011.01); H01R 12/77 (2011.01); B60R 16/02 (2006.01); H01B 7/00 (2006.01); H01B 11/20 (2006.01); H01R 9/05 (2006.01); H01R 12/53 (2011.01); H01R 13/6471 (2011.01);
U.S. Cl.
CPC ...
H01R 12/52 (2013.01); H01B 11/1808 (2013.01); H01R 12/598 (2013.01); H01R 13/025 (2013.01); H01R 24/50 (2013.01); H05K 1/111 (2013.01); H05K 1/145 (2013.01); B60R 16/0207 (2013.01); H01B 7/0045 (2013.01); H01B 11/203 (2013.01); H01R 9/0515 (2013.01); H01R 12/53 (2013.01); H01R 12/596 (2013.01); H01R 12/77 (2013.01); H01R 12/775 (2013.01); H01R 12/79 (2013.01); H01R 13/6471 (2013.01); H01R 2103/00 (2013.01); H05K 2201/10272 (2013.01);
Abstract

In an electronic device having a compact form factor, a space-saving harness using bundled or ribbonized strands of micro-coaxial (micro-coax) cable may be utilized to provide signal and/or power interconnects between EMI-generating peripheral components and other components in the device such as those populated on circuit boards. Discrete wires are included in the harness to provide shielding to adjacent micro-coax conductors which may carry high speed signals such as MIPI (Mobile Industry Processor Interface) differential signal pairs and provide power and ground return paths. The discrete wires are subjected to fabrication processes during assembly of the micro-coax harness so that their outer diameters substantially match that of components in the micro-coax cable to thereby facilitate connectorization or termination to the circuit boards and/or other components in the device. The matching outer diameters can also provide a consistent pitch that may facilitate space-saving geometries for the harness, connector, and/or terminations.


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