The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2019
Filed:
Jun. 04, 2014
Applicant:
Mitsui Mining & Smelting Co., Ltd., Tokyo, JP;
Inventors:
Yoshinori Matsuura, Saitama, JP;
Toshimi Nakamura, Saitama, JP;
Masaharu Myoi, Saitama, JP;
Hajime Watanabe, Saitama, JP;
Assignee:
MITSUI MINING & SMELTING CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/52 (2006.01); H05B 33/10 (2006.01); H05B 33/26 (2006.01); H01B 1/02 (2006.01); H01L 51/00 (2006.01); H01L 51/44 (2006.01); H01L 51/56 (2006.01); H01L 21/445 (2006.01); H01L 21/288 (2006.01);
U.S. Cl.
CPC ...
H01L 51/5203 (2013.01); H01B 1/026 (2013.01); H01L 51/0096 (2013.01); H01L 51/441 (2013.01); H01L 51/5218 (2013.01); H01L 51/5231 (2013.01); H01L 51/56 (2013.01); H05B 33/10 (2013.01); H05B 33/26 (2013.01); H01L 21/288 (2013.01); H01L 21/445 (2013.01); Y02E 10/549 (2013.01); Y02P 70/521 (2015.11);
Abstract
There is provided a high gloss electrodeposited copper foil which can be manufactured in a short time. The electrodeposited copper foil has a fraction of the areas occupied by the {100} plane deviating by 18° or less from the <001> crystal orientation of 10% or more determined by analysis of the surface by electron backscatter diffraction (EBSD) and at least one surface of the electrodeposited copper foil has a glossiness G(20°) of 1,500 or more, determined in accordance with JIS Z 8741-1997.