The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2019

Filed:

Nov. 13, 2018
Applicant:

Dowa Electronics Materials Co., Ltd., Chiyoda-ku, Tokyo, JP;

Inventors:

Takehiko Fujita, Gotenba, JP;

Yasuhiro Watanabe, Akita, JP;

Assignee:

DOWA Electronics Materials Co., Ltd., Chiyoda-ku, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 21/02 (2006.01); H01L 33/06 (2010.01); H01L 33/14 (2010.01); H01L 33/30 (2010.01); H01L 33/32 (2010.01); H01S 5/343 (2006.01); C23C 16/34 (2006.01); B82Y 40/00 (2011.01);
U.S. Cl.
CPC ...
H01L 33/005 (2013.01); C23C 16/34 (2013.01); H01L 21/0242 (2013.01); H01L 21/0254 (2013.01); H01L 21/0262 (2013.01); H01L 21/02433 (2013.01); H01L 21/02458 (2013.01); H01L 21/02579 (2013.01); H01L 33/00 (2013.01); H01L 33/06 (2013.01); H01L 33/14 (2013.01); H01L 33/30 (2013.01); H01L 33/32 (2013.01); H01S 5/343 (2013.01); B82Y 40/00 (2013.01);
Abstract

Provided is a method of producing a III nitride semiconductor light-emitting device having an n-type semiconductor layer, a light emitting layer, a barrier layer, and a p-type semiconductor layer. The p-type semiconductor layer is formed by forming an electron blocking layer on the light emitting layer; supplying a carrier gas containing nitrogen to a surface of the electron blocking layer; and forming a second p-type contact layer made of AlGaN on the electron blocking layer after the nitrogen carrier gas supply step. The second p-type contact formation step is performed using a carrier gas containing hydrogen. Source gases of Al and Ga are supplied to form a first p-type contact layer made of AlGaN with a thickness of more than 0 nm and 30 nm or less directly on the electron blocking layer and directly under the second p-type contact layer.


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