The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2019

Filed:

Nov. 09, 2017
Applicant:

The United States of America, As Represented BY the Secretary of the Navy, Washington, DC (US);

Inventors:

Matthew T. Hardy, Arlington, VA (US);

Brian P. Downey, Alexandria, VA (US);

David J. Meyer, Fairfax, VA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 29/20 (2006.01); H01L 21/308 (2006.01); H01L 29/201 (2006.01); H01L 21/3065 (2006.01);
U.S. Cl.
CPC ...
H01L 29/2003 (2013.01); H01L 21/0254 (2013.01); H01L 21/02378 (2013.01); H01L 21/02439 (2013.01); H01L 21/02458 (2013.01); H01L 21/02502 (2013.01); H01L 21/3065 (2013.01); H01L 21/3081 (2013.01); H01L 29/201 (2013.01);
Abstract

A semiconductor device structure including a scandium (Sc)- or yttrium (Y)-containing material layer situated between a substrate and one or more overlying layers. The Sc- or Y-containing material layer serves as an etch-stop during fabrication of one or more devices from overlying layers situated above the Sc- or Y-containing material layer. The Sc- or Y-containing material layer can be grown within an epitaxial group III-nitride device structure for applications such as electronics, optoelectronics, and acoustoelectronics, and can improve the etch-depth accuracy, reproducibility and uniformity.


Find Patent Forward Citations

Hardy, Matthew. (2019). Scandium-containing iii-n etch-stop layers for selective etching of iii-nitrides and related materials (U.S. Patent No. 10283597). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10283597

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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