The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2019

Filed:

Feb. 12, 2018
Applicant:

Seoul Viosys Co., Ltd., Ansan-si, KR;

Inventors:

Seom Geun Lee, Ansan-si, KR;

Yeo Jin Yoon, Ansan-si, KR;

Jae Kwon Kim, Ansan-si, KR;

So Ra Lee, Ansan-si, KR;

Myoung Hak Yang, Ansan-si, KR;

Assignee:

SEOUL VIOSYS CO., LTD., Ansan-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/06 (2010.01); H01L 27/02 (2006.01); H01L 33/62 (2010.01); H01L 27/15 (2006.01); H01L 33/40 (2010.01); H01L 25/16 (2006.01); H01L 33/32 (2010.01); H01L 33/44 (2010.01);
U.S. Cl.
CPC ...
H01L 27/0255 (2013.01); H01L 25/167 (2013.01); H01L 27/15 (2013.01); H01L 33/06 (2013.01); H01L 33/32 (2013.01); H01L 33/405 (2013.01); H01L 33/62 (2013.01); H01L 33/44 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Disclosed herein is a light emitting diode chip having ESD protection. An exemplary embodiment provides a flip-chip type light emitting diode chip, which includes a light emitting diode part aligned on a substrate, and a reverse-parallel diode part disposed on the substrate and connected to the light emitting diode part. Within the flip-chip type light emitting diode chip, the light emitting diode part is placed together with reverse-parallel diode part, thereby providing a light emitting diode chip exhibiting strong resistance to electrostatic discharge.


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