The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2019

Filed:

Feb. 23, 2018
Applicant:

Fuji Electric Co., Ltd., Kanagawa, JP;

Inventor:

Shin Soyano, Shiojiri, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/053 (2006.01); H01L 23/498 (2006.01); H01L 23/373 (2006.01); G01R 33/00 (2006.01); H01L 21/64 (2006.01); H01L 21/48 (2006.01); H01L 23/14 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H01L 23/24 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49575 (2013.01); G01R 33/0047 (2013.01); H01L 21/4814 (2013.01); H01L 21/64 (2013.01); H01L 23/053 (2013.01); H01L 23/14 (2013.01); H01L 23/3735 (2013.01); H01L 23/49811 (2013.01); H01L 25/07 (2013.01); H01L 25/18 (2013.01); H01L 23/24 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48095 (2013.01); H01L 2924/19107 (2013.01);
Abstract

A semiconductor device includes: a frame; a first-external-terminal provided to a first side portion of the frame; a first substrate enclosed in the frame and having a first-conductive-layer at an upper surface; a first-semiconductor-element: mounted on the first-conductive-layer; having, on a lower surface, a first main electrode connecting with the first-conductive-layer; and having a second main electrode and a control electrode on an upper surface; a first terminal connecting portion establishing a connection between the first-external-terminal and an exposed portion of the first-conductive-layer between the first-semiconductor-element and the first-external-terminal; a first-external-control-terminal provided above a wire in the frame and between the first main electrode of the first-semiconductor-element and the first-external-terminal; and a first control terminal connecting portion establishing a connection: between the control electrode of the first-semiconductor-element and the first-external-control-terminal; and above a wire between the first main electrode of the first-semiconductor-element and the first-external-terminal.


Find Patent Forward Citations

Loading…