The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2019

Filed:

Aug. 09, 2017
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Young Jin Noh, Ansan-si, KR;

Kyung Sun Kim, Suwon-si, KR;

Seung Bo Shim, Seoul, KR;

Yong Woo Lee, Hwaseong-si, KR;

Ji Soo Im, Seongnam-si, KR;

Won Young Choi, Yongin-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/3065 (2006.01); H01L 21/67 (2006.01); C23C 16/458 (2006.01); H01J 37/32 (2006.01); C23C 16/509 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67069 (2013.01); C23C 16/4585 (2013.01); C23C 16/5096 (2013.01); H01J 37/32642 (2013.01); H01J 37/32724 (2013.01); H01L 21/67109 (2013.01); H01L 21/67248 (2013.01); H01L 21/6831 (2013.01); H01L 21/68735 (2013.01);
Abstract

A plasma processing apparatus including an electrostatic chuck supporting a wafer; a focus ring disposed to surround an outer circumferential surface of the wafer; an insulation ring disposed to surround an outer circumferential surface of the focus ring; and an edge ring supporting lower portions of the focus ring and the insulation ring, the edge ring being spaced apart from the electrostatic chuck and surrounding an outer circumferential surface of the electrostatic chuck; wherein the edge ring includes a flow channel containing a fluid therein.


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