The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2019

Filed:

Nov. 07, 2016
Applicant:

Commissariat a L'energie Atomique ET Aux Energies Alternatives, Paris, FR;

Inventors:

Bruno Imbert, Grenoble, FR;

Hubert Moriceau, Saint-Egreve, FR;

Xavier Blot, Grenoble, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/46 (2006.01); H01L 21/18 (2006.01); C09J 5/02 (2006.01); C09J 5/06 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/187 (2013.01); C09J 5/02 (2013.01); C09J 5/06 (2013.01); H01L 24/83 (2013.01); C09J 2203/326 (2013.01);
Abstract

The invention concerns an assembly method comprising the following steps: a) providing a first substrate comprising a first face made from crystalline indium phosphide, b) providing a second substrate comprising a second crystalline face different from the indium phosphide, c) forming an intermediate layer of crystalline indium phosphide on the second face of the second substrate, d) forming an assembly, via a direct bonding step, by bringing the first face of the first substrate into contact with the intermediate layer, the direct bonding step being carried out in an atmosphere having a pressure greater than 10−4 Pa, and preferably higher than 10−3 Pa, e) subjecting the assembly formed in step d) to heat treatment.


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