The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2019

Filed:

Oct. 24, 2017
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Zhijun Chen, San Jose, CA (US);

Anchuan Wang, San Jose, CA (US);

Jiayin Huang, Fremont, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 21/3065 (2006.01); H01J 37/32 (2006.01); C23C 16/34 (2006.01); C23C 16/40 (2006.01); C23C 16/455 (2006.01); H01L 21/768 (2006.01); H01L 21/02 (2006.01); H01L 21/3213 (2006.01); H01L 21/76 (2006.01); H01L 33/44 (2010.01);
U.S. Cl.
CPC ...
H01J 37/32422 (2013.01); C23C 16/345 (2013.01); C23C 16/401 (2013.01); C23C 16/45529 (2013.01); C23C 16/45553 (2013.01); H01L 21/0217 (2013.01); H01L 21/02164 (2013.01); H01L 21/32137 (2013.01); H01L 21/76879 (2013.01);
Abstract

Exemplary methods for laterally etching silicon nitride may include flowing oxygen-containing plasma effluents into a processing region of a semiconductor processing chamber. A substrate positioned within the processing region may include a trench formed through stacked layers including alternating layers of silicon nitride and silicon oxide. The methods may include passivating exposed surfaces of the silicon nitride with the oxygen-containing plasma effluents. The methods may include flowing a fluorine-containing precursor into the remote plasma region while maintaining the flow of the oxygen-containing precursor. The methods may include forming plasma effluents of the fluorine-containing precursor and the oxygen-containing precursor. The methods may include flowing the plasma effluents into the processing region of the semiconductor processing chamber. The methods may also include laterally etching the layers of silicon nitride from sidewalls of the trench.


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