The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2019
Filed:
May. 12, 2017
Applicant:
Soc Corporation, Tokyo, JP;
Inventors:
Toshitaka Ogawa, Tochigi, JP;
Hiroo Arikawa, Tokyo, JP;
Assignee:
SOC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01H 85/143 (2006.01); H01H 69/02 (2006.01); H01H 85/06 (2006.01); H01H 85/08 (2006.01); H01H 85/041 (2006.01); H01H 85/046 (2006.01);
U.S. Cl.
CPC ...
H01H 69/022 (2013.01); H01H 69/02 (2013.01); H01H 85/046 (2013.01); H01H 85/0411 (2013.01); H01H 85/06 (2013.01); H01H 85/08 (2013.01); H01H 85/143 (2013.01);
Abstract
A method for manufacturing a chip fuse, comprises: a liquid film forming step for forming a liquid film of dispersion liquid having metal nanoparticles dispersed therein on a principal surface of a substrate; a fuse film forming step for forming a fuse film on the principal surface by irradiating the liquid film with laser light; and a first terminal forming step for forming first terminals that each connects to the fuse film on each of both end sides in a longitudinal direction of the fuse film on the principal surface.