The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2019

Filed:

Sep. 10, 2018
Applicant:

Sandisk Technologies Llc, Addison, TX (US);

Inventors:

Nimrod Hermesh, Mazkeret Batia, IL;

Eliran Kanza, Holon, IL;

Assignee:

SanDisk Technologies LLC, Addison, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 13/00 (2006.01); H03H 11/30 (2006.01); H01L 25/065 (2006.01); G11C 8/06 (2006.01); G11C 7/00 (2006.01);
U.S. Cl.
CPC ...
G11C 13/0069 (2013.01); G11C 13/004 (2013.01); H01L 25/0657 (2013.01); H03H 11/30 (2013.01); G11C 7/00 (2013.01); G11C 8/06 (2013.01);
Abstract

An apparatus may include a controller configured to communicate with a plurality of dies via a signal path. The controller may notify the dies of its desire to communicate with a target die. In response, the dies may set on-die termination resistances of two or more of the dies to a low resistance value, which in turn may set an overall termination resistance of the memory dies to be lower than the low resistance value. The lower overall termination resistance may be closer to a characteristic impedance of a portion of the signal path comprising packaging components of a packaging of the dies compared to the low resistance value, thereby reducing impedance mismatch between the characteristic impedance of the packaging components and the termination resistance.


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