The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2019
Filed:
Nov. 24, 2015
Oracle International Corporation, Redwood Shores, CA (US);
Govind Saraswat, Santa Clara, CA (US);
Wai Chung William Au, San Jose, CA (US);
Douglas Stanley, Placerville, CA (US);
Anuj Trivedi, Dublin, CA (US);
Oracle International Corporation, Redwood Shores, CA (US);
Abstract
A method involves determining failure in time rate for a circuit. The method may include obtaining circuit data regarding a circuit. The circuit may include a first wire segment and a second wire segment. The method may further include obtaining reliability data. The reliability data may describe a failure of the circuit over a pre-determined time period. The method may further include obtaining a thermal map. The method may further include determining a first failure rate for the first wire segment of the circuit. The first failure rate may be a probability that the first wire segment fails in a predetermined amount of time. The method may further include determining a second failure rate for the second wire segment of the circuit. The method may further include generating a model of the circuit. The model of the circuit may describe the first and the second failure rate of the circuit.