The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2019
Filed:
Jan. 05, 2018
Applicant:
SK Hynix Inc., Icheon-si Gyeonggi-do, KR;
Inventors:
Hak Song Kim, Seoul, KR;
Min Su Park, Seoul, KR;
Assignee:
SK hynix Inc., Icheon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 7/00 (2006.01); G06F 12/02 (2006.01); G06F 3/06 (2006.01); G11C 7/10 (2006.01); G11C 16/26 (2006.01); G11C 5/02 (2006.01); G11C 16/04 (2006.01);
U.S. Cl.
CPC ...
G06F 12/0246 (2013.01); G06F 3/061 (2013.01); G06F 3/0659 (2013.01); G11C 5/025 (2013.01); G11C 7/1063 (2013.01); G11C 7/1069 (2013.01); G11C 16/0483 (2013.01); G11C 16/26 (2013.01);
Abstract
A package module may be provided. The package module may include a first chip and a second chip. The first chip may be configured to receive first pattern data to generate first transmission data in a first write mode. The second chip may be configured to receive the first transmission data to generate and output first sense data in a first read mode.
Kim, Hak. (2019). Package modules and methods of testing operations of chips included therein (U.S. Patent No. 10282289). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10282289
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile