The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2019

Filed:

Mar. 18, 2015
Applicant:

Sony Corporation, Tokyo, JP;

Inventors:

Shogo Shinkai, Kanagawa, JP;

Hiroto Kawaguchi, Kanagawa, JP;

Hiroshi Mizuno, Kanagawa, JP;

Taizo Nishimura, Kanagawa, JP;

Fumihiko Iida, Kanagawa, JP;

Kei Tsukamoto, Kanagawa, JP;

Hayato Hasegawa, Kanagawa, JP;

Tomoko Katsuhara, Kanagawa, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/044 (2006.01); G06F 1/16 (2006.01); G06F 3/041 (2006.01); H03K 17/96 (2006.01); G06F 3/0488 (2013.01);
U.S. Cl.
CPC ...
G06F 3/044 (2013.01); G06F 3/04886 (2013.01); H03K 17/9622 (2013.01); G06F 2203/04102 (2013.01);
Abstract

Provided is a sensor device, including: a deformable first surface; a second surface facing the first surface; an electrode board between the first surface and the second surface, the electrode board including a plurality of capacitive elements arranged in a matrix; a support including a first support layer and a second support layer, the first support layer including a plurality of first columns, the second support layer being layered on the first support layer, the support being deformable following deformation of the first surface, the support connecting at least one of the first surface and the second surface to the electrode board; and a conductor layer supported by the support.


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