The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2019
Filed:
Feb. 06, 2017
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Thomas Zettler, Hoehenkirchen-Siegertsbrunn, DE;
Dirk Hammerschmidt, Finkerstein, AT;
Friedrich Rasbornig, Klagenfurt, AT;
Wolfgang Scheibenzuber, Munich, DE;
Hans-Joerg Wagner, Villach, AT;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/02 (2006.01); G01R 31/26 (2014.01); H01L 21/66 (2006.01); G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
G01R 31/26 (2013.01); G01R 31/2884 (2013.01); H01L 22/32 (2013.01); H01L 22/34 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/181 (2013.01);
Abstract
A semiconductor chip includes a substrate, an integrated circuit, an indentation of the substrate, a conductor track, and also a crossover between the indentation and the conductor track. Detection of a test signal fed into the conductor track is made possible in this way. In various examples, a fracture of the substrate in the region of the indentation can be detected.