The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2019

Filed:

Jun. 30, 2014
Applicant:

Danfoss A/s, Nordborg, DK;

Inventors:

Bjarke Skovgard Dam, Almind, DK;

Georg Fosel, Flensburg, DE;

Carsten Molhede Thomsen, Vejle, DK;

Louis Sullivan, Indianapolis, IN (US);

Assignee:

Danfoss A/S, Nordborg, DK;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F25B 41/06 (2006.01); G05D 7/01 (2006.01); G05D 16/10 (2006.01);
U.S. Cl.
CPC ...
F25B 41/062 (2013.01); G05D 7/0146 (2013.01); G05D 16/106 (2013.01); F25B 2341/061 (2013.01); F25B 2500/01 (2013.01); F25B 2500/26 (2013.01);
Abstract

An expansion valve () for a vapour compression system, the valve () comprising a first valve part () having an outlet orifice () and a piston () movable inside the outlet orifice () in response to a differential pressure across the expansion valve (), controlling a fluid flow through the first valve part (). A cross-sectional flow area of the outlet orifice () between a circumference at an inner surface of the outlet orifice () and a circumference at an outer surface of the piston () varies as a function of the position of the piston () relative to the outlet orifice (). A first cross-sectional flow area is defined at a first differential pressure, and a second cross-sectional flow area is defined at a second differential pressure, where the first cross-sectional flow area is smaller than the second cross-sectional flow area, and the first differential pressure is lower than the second differential pressure.


Find Patent Forward Citations

Loading…