The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2019

Filed:

Jul. 21, 2017
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Jin Wook Chung, Yongin-si, KR;

Kyung Wook Hwang, Hwaseong-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21K 9/232 (2016.01); H01L 33/50 (2010.01); H01L 33/60 (2010.01); H01L 33/06 (2010.01); H01L 33/32 (2010.01); H01L 33/56 (2010.01); H01L 33/64 (2010.01); H01L 25/075 (2006.01); H01L 33/62 (2010.01); F21K 9/27 (2016.01); F21Y 115/10 (2016.01); F21V 3/02 (2006.01); F21K 9/23 (2016.01); F21Y 107/00 (2016.01);
U.S. Cl.
CPC ...
F21K 9/232 (2016.08); H01L 33/06 (2013.01); H01L 33/32 (2013.01); H01L 33/502 (2013.01); H01L 33/56 (2013.01); H01L 33/60 (2013.01); H01L 33/641 (2013.01); F21K 9/23 (2016.08); F21K 9/27 (2016.08); F21V 3/02 (2013.01); F21Y 2107/00 (2016.08); F21Y 2115/10 (2016.08); H01L 25/0753 (2013.01); H01L 33/505 (2013.01); H01L 33/62 (2013.01); H01L 2224/49107 (2013.01); H01L 2224/73265 (2013.01);
Abstract

An LED device includes a transparent substrate having a bar-like shape and having a first surface and a second surface opposed thereto, a plurality of LED chips mounted on the first surface of the transparent substrate and electrically connected to each other, each of the plurality of LED chips having a reflective layer disposed on a surface mounted in the transparent substrate, a first connection terminal and a second connection terminal disposed on opposing ends of the transparent substrate and electrically connected to the plurality of LED chips, a bonding layer interposed between the plurality of LED chips and the transparent substrate and including a metal filler, and a wavelength conversion portion covering the first surface and the second surface of the transparent substrate and the plurality of LED chips.


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