The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2019
Filed:
Sep. 10, 2018
Korea Institute of Science and Technology, Seoul, KR;
Munju Goh, Wanju-gun, KR;
Bon-Cheol Ku, Wanju-gun, KR;
Nam Ho You, Wanju-gun, KR;
Sang Jun Youn, Wanju-gun, KR;
Hyeonuk Yeo, Wanju-gun, KR;
Korea Institute of Science and Technology, Seoul, KR;
Abstract
A cured epoxy resin material is depolymerized by using a composition including a compound represented by the chemical formula of XOY(wherein X is hydrogen, alkali metal or alkaline earth metal, Y is halogen, m is a number satisfying 1≤m≤8 and n is a number satisfying 1≤n≤6), and a reaction solvent, wherein X is capable of being dissociated from XOYand Y radical is capable of being produced from XOYin the reaction solvent. It is possible to carry out depolymerization of a cured epoxy resin material, for example, at a temperature of 200° C., specifically 100° C. or lower, and to reduce processing cost and energy requirement. It is also possible to substitute for a reaction system using an organic solvent as main solvent, so that the contamination problems caused by the organic solvent functioning as separate contamination source may be solved and environmental contamination or pollution may be minimized.