The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2019
Filed:
Apr. 06, 2016
Applicant:
Mitsui Mining & Smelting Co., Ltd., Tokyo, JP;
Inventors:
Satoshi Mogi, Ageo, JP;
Hiroaki Tsuyoshi, Ageo, JP;
Assignee:
MITSUI MINING & SMELTING CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B21C 37/00 (2006.01); C23C 8/42 (2006.01); B32B 15/20 (2006.01); C25D 1/04 (2006.01); C23C 26/00 (2006.01); C23C 8/80 (2006.01); C23C 28/00 (2006.01); C25D 3/38 (2006.01); C25D 5/48 (2006.01); H05K 3/02 (2006.01); H05K 3/18 (2006.01); H05K 3/38 (2006.01); H05K 1/09 (2006.01);
U.S. Cl.
CPC ...
C23C 8/42 (2013.01); B32B 15/20 (2013.01); C23C 8/80 (2013.01); C23C 26/00 (2013.01); C23C 28/322 (2013.01); C23C 28/345 (2013.01); C25D 1/04 (2013.01); C25D 3/38 (2013.01); C25D 5/48 (2013.01); H05K 3/022 (2013.01); H05K 3/188 (2013.01); H05K 3/385 (2013.01); H05K 1/09 (2013.01); H05K 2201/0355 (2013.01); H05K 2203/0307 (2013.01); H05K 2203/0315 (2013.01); H05K 2203/0723 (2013.01); H05K 2203/0726 (2013.01); H05K 2203/0776 (2013.01); H05K 2203/1157 (2013.01); Y10T 428/1259 (2015.01); Y10T 428/12431 (2015.01); Y10T 428/12438 (2015.01);
Abstract
There is provided a roughened copper foil which can significantly improve adhesion to an insulating resin and reliability (e.g., hygroscopic heat resistance). The roughened copper foil of the present invention has at least one roughened surface having fine irregularities composed of acicular crystals, wherein the entire surface of the acicular crystals is composed of a mixed phase of Cu metal and CuO.