The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2019

Filed:

Aug. 01, 2016
Applicant:

Elite Material Co., Ltd., Taoyuan, TW;

Inventors:

Chen-Yu Hsieh, Taoyuan, TW;

Tse-An Lee, Taoyuan, TW;

Hui-Ting Shih, Taoyuan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 5/24 (2006.01); C08K 3/36 (2006.01); C08K 5/14 (2006.01); C08L 73/00 (2006.01); C09D 179/00 (2006.01); C08G 65/48 (2006.01); C08K 5/3415 (2006.01); C08K 5/5399 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
C08G 65/485 (2013.01); C08J 5/24 (2013.01); C08K 3/36 (2013.01); C08K 5/14 (2013.01); C08K 5/3415 (2013.01); C08K 5/5399 (2013.01); C08L 73/00 (2013.01); C09D 179/00 (2013.01); H05K 1/0373 (2013.01); C08J 2371/12 (2013.01); C08J 2379/00 (2013.01); C08J 2471/12 (2013.01); H05K 2201/012 (2013.01);
Abstract

The present invention relates to a phosphorus-containing polyphenylene oxide resin, its preparation method, a method for preparing the prepolymer of the phosphorus-containing polyphenylene oxide, a resin composition and an article thereof, wherein the phosphorus-containing polyphenylene oxide resin has a chemical structure represented by the following formula (I): Through the use of the above phosphorus-containing polyphenylene oxide resin, an article made from the resin composition can has good flame retardance, good thermal resistance and a lower percent of thermal expansion while dielectric properties can be maintained, such that the present invention is suitable for use in products such as copper clad laminate and printed circuit board.


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