Device and method for cutting out contours from planar substrates by means of laser

Abstract

The present invention relates to a method for producing a contour in a planar substrate and for separating the contour from the substrate, in particular for producing an internal contour in a planar substrate and for removing the internal contour from the substrate, wherein, in a contour definition step by means of a laser beam guided over the substrate along a contour line characterizing the contour to be produced, a large number of individual zones of internal damage is produced in the substrate material, in a crack definition step by means of a laser beam guided over the substrate along a plurality of crack line portions, which, viewed from the contour line, leads away at an angle a>0°, and into the contour to be separated, respectively a large number of individual zones of internal damage is produced in the substrate material and, in a material removal step implemented after the contour definition step and after the crack definition step by means of a material-removing laser beam guided over the substrate along a material removal line which extends along the contour line but at a spacing from the latter and also in the contour to be separated, furthermore which preferably cuts the crack line portions, the substrate material is removed over the entire substrate thickness.