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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10279691 B1

PDFFull Text
Date of Patent:
May. 07, 2019

Filed:

Apr. 04, 2013

Contactless feeding pad and contactless feeding device

Applicant:

Denso Corporation, Kariya, Aichi-pref., JP;

Inventors:

Kazuyoshi Obayashi, Chita-gun, JP;

Kouji Mazaki, Kariya, JP;

Eisuke Takahashi, Kariya, JP;

Keisuke Tani, Anjo, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:

Nixon & Vanderhye P.C.

Primary Examiner:

David V Henze-Gongola

Int. Cl.
CPC ...
H02J 7/00 (2006.01); H02J 7/02 (2016.01); H01F 27/38 (2006.01); H01F 27/40 (2006.01); H01F 38/14 (2006.01); H02J 50/12 (2016.01); H02J 50/40 (2016.01); H02J 50/60 (2016.01); H02J 50/80 (2016.01); B60L 11/18 (2006.01);
U.S. Cl.
CPC ...
B60L 11/182 (2013.01); H01F 27/38 (2013.01); H01F 27/40 (2013.01); H01F 38/14 (2013.01); H02J 7/025 (2013.01); H02J 50/12 (2016.02); H02J 50/40 (2016.02); H02J 50/60 (2016.02); H02J 50/80 (2016.02); H02J 2007/0096 (2013.01); Y02T 10/7005 (2013.01); Y02T 10/7072 (2013.01); Y02T 90/122 (2013.01); Y02T 90/14 (2013.01);
Abstract

A contactless feeding pad includes a power-receiving side pad, a power-transmitting side pad, and an auxiliary pad. The power-transmitting side pad is different from the power-receiving side pad in size or shape and transmits electric power contactlessly to the power-receiving side pad while being situated oppositely to the power-receiving side pad. The auxiliary pad is installed between the power-transmitting side pad and the power-receiving side pad in close proximity to the power-transmitting side pad or the power-receiving side pad and forms a resonance circuit.

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