The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2019

Filed:

Oct. 07, 2015
Applicant:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, Ibaraki, JP;

Inventors:

Yusuke Takagi, Hitachinaka, JP;

Takahiro Shimura, Hitachinaka, JP;

Takashi Kuboki, Hitachinaka, JP;

Akira Matsushita, Hitachinaka, JP;

Assignee:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); B60H 1/00 (2006.01); H02M 7/00 (2006.01); H01L 23/367 (2006.01); H01L 23/42 (2006.01); H01L 23/473 (2006.01); H01L 23/492 (2006.01); H02M 7/537 (2006.01);
U.S. Cl.
CPC ...
B60H 1/00914 (2013.01); H01L 23/3675 (2013.01); H01L 23/42 (2013.01); H01L 23/473 (2013.01); H02M 7/003 (2013.01); H05K 7/20927 (2013.01); H01L 23/492 (2013.01); H02M 7/537 (2013.01);
Abstract

The present invention aims to suppress a coolant from bypassing a non-cooling unit without lowering the productivity. The power converter according to the present invention includes: a power semiconductor module; and a flow path forming body having a flow path in which the power semiconductor module is disposed and an opening which is connected with the flow path, wherein the power semiconductor module includes a first fin formed on one surface and a second fin formed on another surface which faces the one surface so as to sandwich the semiconductor element, the flow path forming body has a first coolant control unit and a second coolant control unit which are arranged so as to sandwich the first fin, the first coolant control unit and the second coolant control unit are formed to be overlapped with a region of the power semiconductor module where the first fin is not formed, and a first flow path is formed along the first coolant control unit and the second coolant control unit.


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