The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2019

Filed:

Sep. 20, 2017
Applicant:

Rohm Co., Ltd., Kyoto-shi, Kyoto, JP;

Inventors:

Isamu Nishimura, Kyoto, JP;

Yasuhiro Fuwa, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/335 (2006.01); B41J 2/34 (2006.01);
U.S. Cl.
CPC ...
B41J 2/33595 (2013.01); B41J 2/3351 (2013.01); B41J 2/3353 (2013.01); B41J 2/3354 (2013.01); B41J 2/3355 (2013.01); B41J 2/3357 (2013.01); B41J 2/33515 (2013.01); B41J 2/33525 (2013.01); B41J 2/33545 (2013.01); B41J 2/34 (2013.01);
Abstract

A thermal print head includes a semiconductor substrate, a resistor layer with heat generating portions arranged in the main scanning direction, a wiring layer included in a conduction path for energizing the heat generating portions, and a protective layer covering the resistor layer and the wiring layer. The semiconductor substrate includes a projection protruding from the obverse surface of the substrate and elongated in the main scanning direction. The projection has first and second inclined side surfaces spaced apart from each other in the sub-scanning direction. The heat generating portions are arranged to overlap with the first inclined side surface of the projection as viewed in plan view.


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