The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2019
Filed:
Sep. 26, 2016
Applicant:
Kyocera Corporation, Kyoto-shi, Kyoto, JP;
Inventors:
Arata Okayama, Uji, JP;
Hisatoshi Takada, Okaya, JP;
Tatsuru Seto, Okaya, JP;
Makoto Watanabe, Okaya, JP;
Assignee:
KYOCERA CORPORATION, Kyoto-Shi, Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/335 (2006.01); B41J 2/345 (2006.01);
U.S. Cl.
CPC ...
B41J 2/3352 (2013.01); B41J 2/3351 (2013.01); B41J 2/3354 (2013.01); B41J 2/3357 (2013.01); B41J 2/33515 (2013.01); B41J 2/345 (2013.01);
Abstract
A thermal head includes: a substrate; a heat generating section which is disposed on the substrate; a plurality of driving ICs including first and second driving ICs which are disposed on the substrate and electrically coupled to the heat generating section; and a cover member covering the first and second driving ICs. The cover member is disposed in an inter-driving IC region between the first driving IC and the second driving IC and above and below the inter-driving IC region, and includes a first void.