The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2019
Filed:
Feb. 28, 2018
Applicant:
Canon Kabushiki Kaisha, Tokyo, JP;
Inventors:
Assignee:
Canon Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/16 (2006.01); G03F 7/00 (2006.01); B29C 59/02 (2006.01); G03F 7/038 (2006.01); G03F 7/039 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); G03F 7/32 (2006.01); B30B 15/02 (2006.01); B29K 33/00 (2006.01); B29L 31/00 (2006.01); B29K 707/00 (2006.01); B29K 709/02 (2006.01); B29K 9/00 (2006.01);
U.S. Cl.
CPC ...
B41J 2/1637 (2013.01); B29C 59/022 (2013.01); B29C 59/026 (2013.01); B30B 15/02 (2013.01); B41J 2/162 (2013.01); B41J 2/1631 (2013.01); B41J 2/1635 (2013.01); G03F 7/0002 (2013.01); G03F 7/038 (2013.01); G03F 7/039 (2013.01); G03F 7/16 (2013.01); G03F 7/168 (2013.01); G03F 7/20 (2013.01); G03F 7/32 (2013.01); B29K 2009/00 (2013.01); B29K 2033/12 (2013.01); B29K 2707/00 (2013.01); B29K 2709/02 (2013.01); B29L 2031/767 (2013.01); B41J 2202/22 (2013.01);
Abstract
A pressing method for pressing a surface of a resin layer includes pressing a surface of a resin layer of a wafer using a pressing member, which is to be divided into a plurality of liquid ejection head chips, the wafer including a substrate and the resin layer to serve as an ejection port forming member provided on the substrate. The pressing of the surface of the resin layer is performed by positioning a structure closer to a circumference of the wafer than to an area that becomes the plurality of liquid ejection head chips on the substrate, the structure being in contact with the resin layer.