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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10279539 B1

PDFFull Text
Date of Patent:
May. 07, 2019

Filed:

Oct. 02, 2018

Method of molding a thermoplastic resin article and apparatus for molding same

Applicant:

Toyo Seikan Group Holdings, Ltd., Tokyo, JP;

Inventors:

Satoo Kimura, Kanagawa, JP;

Masaki Aoya, Kanagawa, JP;

Tsutomu Iwasaki, Kanagawa, JP;

Assignee:

TOYO SEIKAN GROUP HOLDINGS, LTD., Tokyo, JP;

Attorney:

Osha Liang LLP

Primary Examiner:

Nahida Sultana

Int. Cl.
CPC ...
B29C 59/16 (2006.01); B29C 59/02 (2006.01); B29C 35/16 (2006.01); B29C 35/08 (2006.01); B29D 11/00 (2006.01); B29L 11/00 (2006.01); B29K 101/12 (2006.01); B29C 43/52 (2006.01);
U.S. Cl.
CPC ...
B29C 59/16 (2013.01); B29C 35/0805 (2013.01); B29C 35/16 (2013.01); B29C 59/02 (2013.01); B29C 59/022 (2013.01); B29C 2035/0822 (2013.01); B29C 2035/1616 (2013.01); B29C 2043/522 (2013.01); B29C 2059/023 (2013.01); B29D 11/00269 (2013.01); B29K 2101/12 (2013.01); B29L 2011/005 (2013.01);
Abstract

Aimed at providing a method for molding a thermoplastic resin product and a molding apparatus therefor that enable productivity, transfer quality or the like to be improved. Provided is a method for molding a thermoplastic resin product that includes a heating step, a transfer step, a cooling step and a mold-releasing step, and wherein, in the heating step, a stamper is irradiated with infrared rays in a state where a cooling member is not irradiated with infrared rays, and at least in the final stage of the transfer step, the stamper and the cooling member are brought into contact.

Find Patent Forward Citations

Kimura, Satoo. (2019). Method of molding a thermoplastic resin article and apparatus for molding same (U.S. Patent No. 10279539). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10279539

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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