The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2019

Filed:

Dec. 22, 2015
Applicant:

10x Technology, Llc, Libertyville, IL (US);

Inventors:

John C. Nelson, The Sea Ranch, CA (US);

Robert M. Pricone, Libertyville, IL (US);

Gregory D. Shields, Round Lake Beach, IL (US);

William T. Nelson, Genoa City, WI (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 53/02 (2006.01); A61B 17/08 (2006.01); A61B 17/00 (2006.01); B29K 33/00 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B29C 53/02 (2013.01); A61B 17/085 (2013.01); A61B 2017/00526 (2013.01); B29K 2033/12 (2013.01); B29K 2995/0077 (2013.01); B29L 2031/753 (2013.01); B29L 2031/756 (2013.01);
Abstract

A method is provided for forming at least one curved polymeric microneedle, wherein the microneedle includes a base portion and an elongated body portion terminating in a sharp tip, said elongated body portion comprising a lower portion that is 15% to 25% of the height of the microneedle, said elongated body portion being connected to said base layer. The method comprises: heating an array comprising said base layer and at least a segment of said elongated body portion; passing the heated array against a fixed member to bend the microneedles; and allowing the bent, heated array to be cooled. The heat applied to the base layer and elongated body portion is sufficient to cause the heated microneedle to be at or above the glass transition temperature of the polymer of the microneedle, but below a temperature that would cause the lower portion to bend during the passing step.


Find Patent Forward Citations

Loading…