The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2019

Filed:

May. 10, 2017
Applicant:

Olympus Corporation, Tokyo, JP;

Inventor:

Kunihiko Hijihara, Hachioji, JP;

Assignee:

OLYMPUS CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61B 1/00 (2006.01); A61B 1/005 (2006.01); G02B 23/24 (2006.01); A61B 1/233 (2006.01);
U.S. Cl.
CPC ...
A61B 1/0052 (2013.01); A61B 1/0011 (2013.01); A61B 1/0057 (2013.01); A61B 1/233 (2013.01); G02B 23/24 (2013.01);
Abstract

An endoscope includes: an insertion portion including a bending portion bendable at least in a vertical direction on a distal end portion side; an operation portion to which a proximal end portion of the insertion portion is connected; a traction wire including a first end and a second end, connected to the insertion portion at the first end, and configured to bend the bending portion by being pulled; a fixing member fixed to the second end of the traction wire; a holding member configured to hold the fixing member; and a pulley turnably provided inside the operation portion and including a disposing portion where the holding member is disposed.


Find Patent Forward Citations

Quick Actions:

Hijihara, Kunihiko. (2019). Endoscope (U.S. Patent No. 10278567). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10278567

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…