The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2019

Filed:

Sep. 25, 2017
Applicant:

Harman International Industries, Incorporated, Stamford, CT (US);

Inventors:

David Jia, Houston, TX (US);

Valod Noshadi, Ettlingen, DE;

Homero Garza, Wixom, MI (US);

Alex Tzinares, Ann Arbor, MI (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 5/00 (2006.01); H05K 7/20 (2006.01); H05K 9/00 (2006.01); H05K 1/14 (2006.01); H05K 7/14 (2006.01); B60K 37/02 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0007 (2013.01); H05K 1/0203 (2013.01); H05K 1/144 (2013.01); H05K 5/0004 (2013.01); H05K 5/0017 (2013.01); H05K 5/0021 (2013.01); H05K 7/1427 (2013.01); H05K 7/20218 (2013.01); H05K 7/20409 (2013.01); B60K 37/02 (2013.01); B60K 2350/302 (2013.01); H05K 2201/042 (2013.01);
Abstract

The present disclosure relates to electronic devices and configurations. In one embodiment, an electronic device includes a plurality of circuit boards and a plurality of chassis enclosures. Each of the plurality of circuit boards is separately housed by a chassis enclosure. Each chassis enclosure includes a front housing and a back housing, the front housing and back housing configured to retain a circuit board, and at least one heat dissipation element. The plurality of chassis enclosures are mounted to provide an air gap for heat dissipation between each chassis enclosures. Each chassis enclosure electrically shields a retained circuit board.


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