The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2019

Filed:

Apr. 25, 2013
Applicant:

Intelligent Devices Sezc Inc., Grand Cayman, KY;

Inventors:

Allan Wilson, Ottawa, CA;

Michael Petersen, Ottawa, CA;

Dean Brotzel, Ottawa, CA;

Assignee:

Intelligent Devices Sezc Inc., Grand Cayman, KY;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61J 1/03 (2006.01); A61J 7/04 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/12 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
H05K 1/118 (2013.01); A61J 1/035 (2013.01); A61J 7/0409 (2013.01); H05K 3/1275 (2013.01); A61J 7/0436 (2015.05); A61J 2205/20 (2013.01); H05K 1/0269 (2013.01); H05K 1/0287 (2013.01); H05K 1/16 (2013.01); H05K 2203/1545 (2013.01); Y10T 29/49155 (2015.01);
Abstract

There is provided a smart package and monitoring system having a status indicator and a method of making the same. The smart package includes an electronic sensor monitoring tag having re-usable electronic circuitry and power source along with a conductive grid printed on a thin flexible substrate and connected to the tag so the tag and grid are in electrical continuity to form a monitoring device. The conductive grid is aligned with an opening of the smart package. The smart package can also include an optical ink indicator configured to display the status of the package. A multiplexer can be used to connect the tag to the conductive grid. The conductive grid can include capacitive sensors formed on a thin plastic layer and positioned so as to form a capacitive element with the conductive side of the blister.


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