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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10278280 B1

PDFFull Text
Date of Patent:
Apr. 30, 2019

Filed:

Jan. 28, 2017

Component carrier comprising a copper filled multiple-diameter laser drilled bore

Applicant:

At&s (China) Co. Ltd., Shanghai, CN;

Inventors:

Nikolaus Bauer-Öppinger, Gramastetten, AT;

ZhaoJian Chen, Shanghai, CN;

Yucun Dou, Shanghai, CN;

Wilhelm Tamm, Salem, DE;

Assignee:

AT&S (China) Co. Ltd., Minhang District, Shanghai, CN;

Attorneys:

Robert A. Blaha

Smith Tempel Blaha LLC

Primary Examiner:

Timothy J Thompson

Assistant Examiner:

Amol H Patel

Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/42 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 1/09 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0206 (2013.01); H05K 1/09 (2013.01); H05K 1/112 (2013.01); H05K 1/181 (2013.01); H05K 3/0026 (2013.01); H05K 3/42 (2013.01); H05K 1/0209 (2013.01); H05K 3/0035 (2013.01); H05K 2201/096 (2013.01); H05K 2201/09509 (2013.01); H05K 2201/09781 (2013.01); H05K 2201/09827 (2013.01); H05K 2201/09854 (2013.01); H05K 2203/107 (2013.01); H05K 2203/1476 (2013.01);
Abstract

A component carrier includes a layer stack formed of an electrically insulating structure and an electrically conductive structure. Furthermore, a bore extends into the layer stack and has a first bore section with a first diameter (D) and a connected second bore section with a second diameter (D) differing from the first diameter (D). A thermally conductive material fills substantially the entire bore. The bore is in particular formed by laser drilling.

Find Patent Forward Citations

Bauer-Öppinger, Nikolaus. (2019). Component carrier comprising a copper filled multiple-diameter laser drilled bore (U.S. Patent No. 10278280). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10278280

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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