The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2019
Filed:
Nov. 18, 2015
Goertek.inc, Weifang, Shandong, CN;
Zhibing Zhang, Weifang, CN;
Gang Chen, Weifang, CN;
Goertek.Inc, Weifang, Shandong, CN;
Abstract
The present invention discloses a speaker module. The speaker module comprises an inner cavity defined by a shell, and a first induction coil. A single speaker piece is provided in the inner cavity of the shell, the first induction coil is configured to be electrically connected with a terminal device, and a second induction coil, which corresponds to the first induction coil and is configured to be electrically connected with a voice coil in the single speaker piece, is also provided on the shell. According to the speaker module, an output end of a complete machine and the voice coil are conducted through the first induction coil and the second induction coil; and by the adoption of such a structure, the space of the module can be greatly saved, and a lighter and thinner complete machine can be developed. In addition, the problems, such as poor performance due to the change of the resistance value in a traditional electro-acoustic connection way, can be solved. By the adoption of the structure, the first induction coil is allowed to be provided outside the inner cavity, the shell can be sealed at a time, wiring from the outside to the inside is not needed any more. In this way, secondary sealing of a lead position is avoided, production and transportation of the speaker module are greatly simplified, and assembly between the speaker module and the terminal device is also greatly simplified.