The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2019
Filed:
Nov. 22, 2017
Applicants:
Hyundai Motor Company, Seoul, KR;
Kia Motors Corporation, Seoul, KR;
Inventor:
Ilseon Yoo, Suwon-si, KR;
Assignees:
Hyundai Motor Company, Seoul, KR;
Kia Motors Corporation, Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 3/00 (2006.01); H04R 7/16 (2006.01); H04R 1/04 (2006.01); H04R 7/10 (2006.01); H04R 19/00 (2006.01); H04R 19/04 (2006.01); H04R 7/26 (2006.01);
U.S. Cl.
CPC ...
H04R 7/16 (2013.01); H04R 1/04 (2013.01); H04R 7/10 (2013.01); H04R 7/26 (2013.01); H04R 19/005 (2013.01); H04R 19/04 (2013.01); H04R 2307/207 (2013.01);
Abstract
A microphone apparatus is disclosed. A microphone apparatus according to an exemplary embodiment includes a vibration membrane disposed inside a case and formed on an upper surface of a main substrate; an acoustic component including an absorbing unit cut over a predetermined section toward the outside of a fixed membrane and having a predetermined pattern; a microphone module including a semiconductor chip electrically connected to the acoustic component inside the case; and a printed circuit board on which the microphone module is mounted.