The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2019

Filed:

Jun. 19, 2017
Applicant:

Lotes Co., Ltd, Keelung, TW;

Inventor:

Chang Wei Huang, Keelung, TW;

Assignee:

LOTES CO., LTD, Keelung, TW;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 12/71 (2011.01); H01R 12/70 (2011.01); H01R 12/52 (2011.01); H01R 13/24 (2006.01); H01R 13/428 (2006.01); H01R 13/6585 (2011.01); H01R 13/6587 (2011.01); H01R 12/00 (2006.01); H01R 13/193 (2006.01); H01R 12/50 (2011.01); H05K 7/10 (2006.01);
U.S. Cl.
CPC ...
H01R 12/7076 (2013.01); H01R 12/52 (2013.01); H01R 12/707 (2013.01); H01R 12/714 (2013.01); H01R 13/2442 (2013.01); H01R 13/428 (2013.01); H01R 13/6585 (2013.01); H01R 13/6587 (2013.01); H01R 9/096 (2013.01); H01R 13/193 (2013.01); H01R 23/72 (2013.01); H05K 7/103 (2013.01);
Abstract

An electrical connector for electrically connecting a chip module includes an insulating body, a signal terminal received in the insulating body, and a first and a second shielding sheets retained in the insulating body. The insulating body sustains a chip module, and the signal terminal elastically urges against the chip module. The first shielding sheet is located on one side of the signal terminal and elastically urges the chip module. The second shielding sheet is located on the other side of the signal terminal, and adjacent to the first shielding sheet. The first and second shielding sheets are communicated through an electric conductor. The second shielding sheet does not urge the chip module.


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