The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2019

Filed:

Feb. 06, 2018
Applicant:

Sandisk Technologies Llc, Plano, TX (US);

Inventors:

Ming-Che Wu, San Jose, CA (US);

Tanmay Kumar, Pleasanton, CA (US);

Assignee:

SanDisk Technologies LLC, Addison, TX (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 45/00 (2006.01); H01L 27/24 (2006.01); G11C 13/00 (2006.01); G11C 11/56 (2006.01);
U.S. Cl.
CPC ...
H01L 45/146 (2013.01); G11C 11/5685 (2013.01); G11C 13/004 (2013.01); G11C 13/0007 (2013.01); G11C 13/0023 (2013.01); G11C 13/0026 (2013.01); G11C 13/0028 (2013.01); G11C 13/0069 (2013.01); H01L 27/249 (2013.01); H01L 27/2454 (2013.01); H01L 45/04 (2013.01); H01L 45/06 (2013.01); H01L 45/12 (2013.01); H01L 45/1226 (2013.01); H01L 45/1233 (2013.01); H01L 45/147 (2013.01); H01L 45/1608 (2013.01); G11C 2013/0054 (2013.01); G11C 2213/71 (2013.01); G11C 2213/77 (2013.01);
Abstract

Systems and methods for providing a Barrier Modulated Cell (BMC) structure that may comprise a reversible resistance-switching memory element within a memory array are described. The BMC structure may include a barrier layer comprising a layer of amorphous germanium or amorphous silicon germanium paired with a conductive metal oxide, such as titanium dioxide (TiO2), strontium titanate (SrTiO3), or a binary metal oxide. The BMC structure may include a conductive metal oxide in series with an amorphous layer of a low bandgap material. The low bandgap material may comprise a semiconductor material with a bandgap energy (Eg) less than 1.0 eV. The improved BMC structure may be used for providing multi-level memory elements within a three dimensional memory array.


Find Patent Forward Citations

Loading…