The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2019

Filed:

Apr. 12, 2018
Applicants:

Industrial Technology Research Institute, Hsinchu, TW;

Intellectual Property Innovation Corporation, Hsinchu, TW;

Inventors:

Yi-Hsiang Huang, Changhua, TW;

Cheng-Chung Lee, Hsinchu, TW;

Jia-Chong Ho, Hsinchu, TW;

Wei-Han Chen, Taipei, TW;

Shin-Hong Kuo, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/15 (2006.01); H01L 33/08 (2010.01); H01L 33/40 (2010.01); H01L 33/50 (2010.01); H01L 33/56 (2010.01); H01L 33/62 (2010.01); H01L 33/64 (2010.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 33/56 (2013.01); H01L 25/0753 (2013.01); H01L 27/156 (2013.01); H01L 33/08 (2013.01); H01L 33/405 (2013.01); H01L 33/504 (2013.01); H01L 33/62 (2013.01); H01L 33/644 (2013.01);
Abstract

A photoelectric device package including a substrate, a first circuit layer, a carrier structure, a second circuit layer, at least one photoelectric device, and a first encapsulation layer is provided. The first circuit layer is disposed on the substrate. The carrier structure is disposed on the substrate and covers the first circuit layer. The carrier structure includes a first dielectric layer, a second dielectric layer, and an elastic layer disposed between the first dielectric layer and the second dielectric layer. The Young's modulus of the elastic layer is less than the Young's modulus of the first dielectric layer and the second dielectric layer. The second circuit layer is disposed on the carrier structure. The photoelectric device is disposed on the carrier structure and is electrically connected to the first and second circuit layers. The first encapsulation layer is disposed on the carrier structure and encapsulates the photoelectric device.


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