The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2019

Filed:

Dec. 26, 2017
Applicant:

Nichia Corporation, Anan-shi, JP;

Inventors:

Koji Abe, Tokushima, JP;

Yasushi Okamoto, Itano-gun, JP;

Assignee:

NICHIA CORPORATION, Anan-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/54 (2010.01); H01L 33/50 (2010.01); H01L 33/44 (2010.01); F21K 9/90 (2016.01); F21K 9/60 (2016.01); H01L 33/60 (2010.01); H01L 33/00 (2010.01); H01L 33/56 (2010.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
H01L 33/504 (2013.01); F21K 9/60 (2016.08); F21K 9/90 (2013.01); H01L 33/005 (2013.01); H01L 33/44 (2013.01); H01L 33/508 (2013.01); H01L 33/54 (2013.01); H01L 33/56 (2013.01); H01L 33/60 (2013.01); F21Y 2115/10 (2016.08);
Abstract

A method for manufacturing a light emitting device includes providing a package having a recess in which a light emitting element is disposed. A translucent sealing material is provided in the recess to encapsulate the light emitting element. A film is provided on the translucent sealing material. The film includes a translucent base material and particles disposed in the translucent base material. The film has a contact surface to contact the translucent sealing material and an outer surface opposite to the contact surface. Abrasive is blasted onto the outer surface of the film to roughen the outer surface so as to expose at least one of the particles.


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