Method of forming a gate contact structure and source/drain contact structure for a semiconductor device

Abstract

One illustrative method disclosed includes, among other things, forming a sacrificial S/D contact structure above an S/D region of a transistor device, removing at least a portion of a gate cap and at least a portion of a gate sidewall spacer to define a gate contact cavity that is positioned entirely above the active region and exposes an upper surface of a gate structure of the transistor device, and forming an internal sidewall spacer within the gate contact cavity. The method also includes performing at least one process operation to remove at least the sacrificial S/D contact structure and define a S/D contact cavity, and forming a gate contact structure within the gate contact cavity that is conductively coupled to the gate structure and forming a S/D contact structure within the S/D contact cavity that is conductively coupled to the S/D region.