The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2019

Filed:

Oct. 01, 2013
Applicants:

Fraunhofer-gesellschaft Zur Forderung Der Angewandten Forschung E.v., Munich, DE;

Albert-ludwigs-universitat Freiburg;

Inventors:

Christian Gossler, Freiburg, DE;

Ulrich Schwarz, Freiburg, DE;

Patrick Ruther, Karlsruhe, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 29/18 (2006.01); H01L 27/15 (2006.01); H01L 25/075 (2006.01); H01L 33/62 (2010.01); A61N 5/06 (2006.01); H01L 33/08 (2010.01); H01L 33/32 (2010.01); A61N 1/05 (2006.01);
U.S. Cl.
CPC ...
H01L 27/156 (2013.01); A61N 5/0601 (2013.01); A61N 5/0622 (2013.01); H01L 25/0753 (2013.01); H01L 33/0079 (2013.01); H01L 33/08 (2013.01); H01L 33/62 (2013.01); A61N 1/0541 (2013.01); A61N 1/0551 (2013.01); A61N 2005/0652 (2013.01); H01L 33/32 (2013.01);
Abstract

A method for producing a micro-LED matrix by (A) depositing an LED layer structure onto a working substrate; (B) singulating a plurality of LED structures from the LED layer structure on the working substrate; (C) applying a first contact-making structure to a carrier substrate; and (D) transferring the plurality of LED structures from the working substrate to the carrier substrate by bonding and laser lift-off. An at least two-layered carrier substrate is used, including a carrier layer and a first flexible polymer layer, in step C the first contact-making structure is applied indirectly or directly to a side of the first polymer layer which faces away from the carrier layer, and in an additional method step D-0 between method steps C and D, a second flexible polymer layer is formed at least between the singulated LED structures. A micro-LED matrix and use are also provided.


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